TPMplt: Tool-Kit for Dynamic Materials Model and Thermal Processing Maps

Provides a simple approach for constructing dynamic materials modeling suggested by Prasad and Gegel (1984) <doi:10.1007/BF02664902>. It can easily generate various processing-maps based on this model as well. The calculation result in this package contains full materials constants, information about power dissipation efficiency factor, and rheological properties, can be exported completely also, through which further analysis and customized plots will be applicable as well.

Version: 0.1.4
Depends: R (≥ 2.10)
Imports: VBTree, methods, ggplot2, metR, rgl, e1071, grDevices, graphics, stats, utils, RColorBrewer, dlm
Suggests: testthat, knitr, rmarkdown
Published: 2024-01-19
DOI: 10.32614/CRAN.package.TPMplt
Author: Chen Zhang ORCID iD [aut, cre, cph], Huakang Bian [ctb], Kenta Yamanaka ORCID iD [ths], Akihiko Chiba [ths]
Maintainer: Chen Zhang <chen.zhang_06sept at>
License: GPL-3
NeedsCompilation: no
Materials: README
CRAN checks: TPMplt results


Reference manual: TPMplt.pdf
Vignettes: TPMplt-vignette


Package source: TPMplt_0.1.4.tar.gz
Windows binaries: r-devel:, r-release:, r-oldrel:
macOS binaries: r-release (arm64): TPMplt_0.1.4.tgz, r-oldrel (arm64): TPMplt_0.1.4.tgz, r-release (x86_64): TPMplt_0.1.4.tgz, r-oldrel (x86_64): TPMplt_0.1.4.tgz
Old sources: TPMplt archive


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